High-Tg Halogen Free and Antimony Free PI-Coverlay

Feature
Characteristic
Property Spec Test Method
Product Structure AGICX025 (Hmil)
 AGICX015 (Hmil)
 -----
Peel Strength (kgf/cm) As Received 1.95 1.73 IPC-TM650 2.4.9
Dimensional Stability (%) MD direction ±0.15% ±0.15% IPC-TM650 2.2.4C
TD direction ±0.15% ±0.15%
Solder Resistance No stratified bubbles ＞300℃×10S ＞300℃×10S IPC-TM650 2.4.13
Resin Flow (mm) DR side /OP side 0.09 ~ 0.10 0.06 ~0.90 APLUS Spec
Releasing force (gf/5cm) 5~20 5~20 APLUS Spec
Volume Resistance (Ω) ＞10 E+14 ＞10 E+14 IPC-TM-650
2.5.17
Surface Resistance (Ω.cm) ＞10 E+12 ＞10 E+12
Shelf Life 10℃↓65%RH↓ 3 months 3 months APLUS Spec

※ Post cure condition: ramp=160℃/hr, from room temperature to 160℃ for 1 hour

Excellent high-temperature adhesion


Production specifications list
Product Name Specification
  PI Flim (um) Glue AD (um) Width (mm) Length (M) Core Diameter
AGICX015X1PMN 12.5 15 250 or 500 100 3 inches
AGICX025X1MMN 12.5 25 250 or 500 100 3 inches
AGICX135X1RM3 25 35 250 or 500 100 3 inches
AGICX135X1SM 25 35 250 or 500 100 3 inches

Halogen Free and Antimony Free PI-Coverlay

Feature
Characteristic
Property Spec Test Method
Product structure   AHICX015N (Hmil)
 AHICX025N (Hmil)
-----
Thickness (um) ±3 26 37 APLUS Spec
Peel Strength (kgf/cm) Copper peel ≥0.7 1.34 1.51 IPC-TM650
2.4.9
Solder Resistance 300℃×10S 330℃×10S 330℃×10S IPC-TM650  
2.4.13
Resin Flow (mm)  < 0.2 < 0.0721 < 0.0913 APLUS Spec
Releasing force (gf/5cm) 5~20 10 12 APLUS Spec
Dimensional Stability (%) MD ≤±0.15 ≤±0.15 ≤±0.15 IPC-TM-650  
2.2.4
TD ≤±0.15 ≤±0.15 ≤±0.15
Insulation Resistance (Ω) ＞ 1.0E+12 ＞ 1.0E+12 ＞ 1.0E+12 ＞1.0E+12 IPC-TM650 
2.5.17
＞ 1.0E+14 ＞ 1.0E+14 ＞ 1.0E+14 ＞ 1.0E+14
Shelf Life 10℃↓65%RH↓ 3 months 3 months 3 months APLUS Spec

※ ※ Post cure condition: from room temperature to 160℃ for 1 hour

※ Excellent resistance to ion migration

Test condition:Bias—50V, Temperature--85℃, L/S—(50um/50um), Test time—1000hr



Production specifications list
Product Name Specification
  PI Flim (um) Glue AD (um) Width (mm) Length (M) Core Diameter
AHICX015X1PMN 12.5 15 250 or 500 100 3 inches
AHICX015X1PMN. 12.5 15 250 or 500 100 3 inches
AHICX015X1KMN. 12.5 15 250 or 500 100 3 inches
AHICX015X1MMN 12.5 15 250 or 500 100 3 inches
AHICX015X1RM6*. 12.5 15 250 or 500 100 3 inches
AHICX025X1PMN 12.5 25 250 or 500 100 3 inches
AHICX025X1PMN. 12.5 25 250 or 500 100 3 inches
AHICX025X1KMN. 12.5 25 250 or 500 100 3 inches
AHICX025X1MMN 12.5 25 250 or 500 100 3 inches
AHICX025X1RM6*. 12.5 25 250 or 500 100 3 inches
AHICX025X1CMN*. 12.5 25 250 or 500 100 3 inches
AHICX125X1MMN 25 25 250 or 500 100 3 inches
AHICX125X1SMN 25 25 250 or 500 100 3 inches
AHICX135X1MMN 25 35 250 or 500 100 3 inches
AHICX135X1SMN 25 35 250 or 500 100 3 inches

Black Halogen Free and Antimony Free PI-Coverlay

Feature
Characteristic
Property Spec Test Method
Product structure   ABICX015 (Hmil)
 ABICX025 (Hmil)
 -----
Thickness (um) ±3 26 37 APLUS Spec
Peel Strength (kgf/cm) Copper peel ≥0.7 1.21 1.31 IPC-TM650
2.4.9
Solder Resistance 300℃×10S 330℃×10S 330℃×10S IPC-TM650  
2.4.13
Resin Flow (mm)  < 0.2 < 0.0771 < 0.0923 APLUS Spec
(gf/5cm) Releasing force 5~20 8 11 APLUS Spec
Dimensional Stability (%) MD ≤±0.15 ≤±0.15 ≤±0.15 IPC-TM-650  
2.2.4
TD ≤±0.15 ≤±0.15 ≤±0.15
Insulation Resistance (Ω) ＞ 1.0E+12 ＞ 1.0E+12 ＞ 1.0E+12 ＞1.0E+12 IPC-TM650 
2.5.17
＞ 1.0E+14 ＞ 1.0E+14 ＞ 1.0E+14 ＞ 1.0E+14
Shelf Life 10℃↓65%RH↓ 3 months 3 months 3 months APLUS Spec

※ Post cure condition: from room temperature to 160℃ for 1 hour

Production specifications list
  Item PI Flim (um) Glue AD (um) Width(mm) Length (M) Core Diameter
Black Cover lay Black PI Film AHICX125X1JMN 25 25 250 or 500 100 3 inches
Black adhesive) ABICX025X1MMN 12.5 25 250 or 500 100 3 inches
ABICX125X1MMN 25 25 250 or 500 100 3 inches