| Property | Spec | AHIQX325 | AHIQX525 | Test Method | |
|---|---|---|---|---|---|
| Product Structure | ----- | ![]() |
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| Thickness | μm | Standard value ±10 | 100 | 150 | ASTMD-374-94 |
| Peel Strength (kgf/cm) | PI side | >1.00 | >1.44 | >1.67 | IPC-TM-650 2.4.9 |
| Cu side | >1.00 | >2.40 | >2.55 | ||
| Solder Resistance | ℃ | 300℃×30S | OK | OK | IPC-TM-650 2.4.13 |
| Resin Flow | mm | ≤0.3 | <0.21 | <0.24 | APLUS Spec |
| Volume Resistivity | Ω.cm | >1.0E+12 | >2.0E+12 | >5.0E+12 | IPC-TM-650 2.5.17 |
| Surface Resistance | Ω | >1.0E+14 | >3.0E+14 | >6.0E+14 | |
| UL Flame Class | — | 94-V0 | PASS | PASS | UL 94-V0 |
| Shelf Life | 10℃↓70%RH↓ | 3 months | 3 months | 3 months | APLUS Spec |
※ Fast lamination condition::at 180℃×100Mpa×60sec
※ The feature value of the product is a representative value, not a specification value.
| Type | Item | PI Flim (um) |
Glue AD(um) |
Copper (um) |
Width (mm) |
Length (M) |
Core Diameter | |
|---|---|---|---|---|---|---|---|---|
| Halogen-free Stiffener | SONY | AHIQX335XSD | 75 | 35 | -- | 250 | 100 | 3 inches |
| AHIQX435XSD | 100 | 35 | -- | 250 | 100 | 3 inches | ||
| AHIQX535XSD | 125 | 35 | -- | 250 | 100 | 6 inches | ||
| AHIQX635XSD | 150 | 35 | -- | 250 | 50 | 6 inches | ||
| AHIQX735XSD | 175 | 35 | -- | 250 | 50 | 6 inches | ||
| AHIQX835XSD | 200 | 35 | -- | 250 | 50 | 6 inches | ||
| AHIQX935XSD | 225 | 35 | -- | 250 | 50 | 6 inches | ||
| T Series | AHIQX335XST | 75 | 35 | -- | 250 | 100 | 3 inches | |
| AHIQX435XST | 100 | 35 | -- | 250 | 100 | 3 inches | ||
| AHIQX535XST | 125 | 35 | -- | 250 | 100 | 6 inches | ||
| AHIQX635XST | 150 | 35 | -- | 250 | 50 | 6 inches | ||
| AHIQX735XST | 175 | 35 | -- | 250 | 50 | 6 inches | ||
| AHIQX835XST | 200 | 35 | -- | 250 | 50 | 6 inches | ||
| AHIQX935XST | 225 | 35 | -- | 250 | 50 | 6 inches | ||